Latest technology of wafer coating material for advanced packages

Abstract In recent years, as electronic devices such smartphones become more functional, compact, and lower cost, many semiconductor makers are studying the packages WLP (Wafer Level Package) having re-distribution layer (RDL).With miniaturization increase in number of pins a package, method conduction between chip an external electrode has been changed from wire connection to bump RDL. And application wafer coating material is also required have higher functions buffer coat film protection interlayer insulating for Further, addition purpose avoiding performance deterioration device due high-temperature treatment, package low heat resistance sometimes used FOWLP, therefore, temperature curable. We developed PBO that can be cured at by shortening distance hydroxyl group carbonyl precursor.